Performance Material - All Be Connect

EMI Microwave Absorber

Flexible, durable and thin EMI Microwave Absorber is designed to have maximum power loss and minimum reflection up to 18GHz. The non-conductive adhesive layer offers flexibility to apply the product onto critical noise source area. With this excellent wide range performance, it is well suited for application areas such as mitigating noises various high speed electronic products, reducing interference / coupling between antennas, etc.

RF Shielding Film

RF Shielding Film (or EMI Shielding Film) is applied on electronic products to reduce the unintended emission. It is a perfect solution to excessive leakage on Flexible Printed Circuits (FPC), due to imperfect discontinuities between connectors. ABCRF series has excellent features, such as over 1million bending life, thin, light, high shielding effectiveness and withstand temperature from -20 to 65⁰C.

Ferrite Sheet

Ferrite Sheet Material (FS Series) is a magnetic sheet with high permeability and ultra-thin. It concentrates magnetic flux and consequently improves the overall energy and data transfer in RFID and NFC communication technology. The recent upcoming application – wireless power transfer could greatly benefit from this high performance material as it greatly enhances the wireless charging efficiency.

Conductive Foam

With the gradually increasing data speed, operating frequency and design complexity, the effort to fulfil Electromagnetic Compatibility requirements become extremely challenging. One of the key areas to mitigate radiation emission is to achieve excellent shielding effectiveness on chassis. In contrary to conventional shielding method, ABCCF 100 series offers a new dimension to enhance shielding effectiveness and conductivity in seams and gaps. This product can be customized to suit your application by die-cutting, hole punching and notching.

Thermal Gap Filler

ABCTGF 500 series thermal gap filler is designed to offer excellent thermal performance and conformability to meet today’s industrial needs. Its soft, flexible, viscous surface, great insulation and low level of thermal resistance makes it ideal for heat transfer applications. The product is RoHS and HALOGEN compliant. We offer a wide range of different thickness to suit the user application needs. Please contact us for more details.

Thermal Gap Filler (Soft)

ABCTGFS 300 series offers high insulation material property, thermal conductivity (or low thermal resistance) and compression ratio. It is perfectly suited to fill the gap between surfaces or served as “cushion” between surfaces, thus allowing efficient heat transfer to take place. Besides that, its dynamic flexibility or “softness” does offer shock mitigation and come with variable thickness, ranging from 1-4mm. The product is RoHS and HALOGEN compliant.

Thermal Interface